|Sikadur 31 Hi-Mod Gel
||2-component, 100% solids, moisture-tolerant, high-modulus, high-strength,
structural epoxy paste adhesive. It conforms to the current ASTM C-881 and
AASHTO M-235 specifications.
|Sikadur 33 Hi-Mod Gel
||Sikadur 33 is a 2-component, 100% solids, moisture-tolerant, high modulus, high
strength, structural, smooth paste epoxy adhesive. It conforms to the current ASTM
C-881 and AASHTOM-235 specifications, except for gel time.
|Sikadur 35 Hi-Mod Gel
||Sikadur 35, Hi-Mod LV, is a 2-component 100% solids, moisture-tolerant, low-viscosity,
high-strength, multi-purpose, epoxy resin adhesive. It conforms to the current
ASTMC-881 and AASHTOM-235 specifications.
||One-component, gun-grade, adhesive and sealing compound of permanent
elasticity. This dual-purpose material is based on a special moisture-cured
polyurethane with an accelerated curing time.